Hi, I am looking for someone to write an article on circuit soldering assignment Paper must be at least 500 words. Please, no plagiarized work!

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Hi, I am looking for someone to write an article on circuit soldering assignment Paper must be at least 500 words. Please, no plagiarized work! Soldering is the process of utilizing a filler material mainly to join pieces of metal together (Jepson, Tyler & Gregory,pp. 167-189). In soldering, the prevailing filler material becomes liquid, coats the underlying pieces in contact then cool.

Tools and materials

The main tools used in soldering process are soldering iron, solder, soldering iron tips, and soldering iron holder couple with cleaning sponge, wires, clips, exhaust fan, and safety goggles.

Soldering iron mainly supplies adequate heat to melt solder by transferring the heat when iron tip is applied to the link to be soldered. It is mainly categorized into temperature-controlled soldering iron, soldering with soldering gun and gas powered soldering iron (Jepson, Tyler & Gregory, pp. 167-189). Solder or filler is alloy made up of mixture of tin and lead in diverse proportions and co-exist in both plastic and semi liquid state. It normally commences melting at 183 degree centigrade. Plastic solder differs subject to the proportion of tin and lead. Exhaust fan aids in preventing an individual from inhaling the solder fumes in the soldering station. Safety goggles prevents flying solders from entering the eyes of the person undertaking soldering process whilst clips aids in holding the work piece being join (Jepson, Tyler & Gregory, pp. 178-198).

Moistening action of solder

Moistening action is the flush action of solder, which normally develops intermetallic connection amidst the sections. It occurs when hot solder encounters with the copper surface forming a metal solvent action thereby making the solder to dissolves and infiltrates the prevailing copper surface. This makes the molecules of solder and copper to blend thus forming a new alloy with one part copper and the other solder (Jepson, Tyler & Gregory, pp. 167-189). The process solely occurs when the superficial of copper does not have impurity and corresponding oxide film.

Soldering flux and accomplishment of soldering

Suitable solder links is accomplished with cleaned surfaces with solvents before soldering process. Fluxes are utilized in overcoming oxide film on electronic and it mainly entail normal or synthetic rosins and chemical additives.

A flux removes oxide during the soldering operation via flux action, which is extremely corrosive at the solder melt temperatures (Jepson, Tyler & Gregory, pp. 167-189). Melt temperature is normally responsible for the flux’s capability to rapidly removal of oxides. Nevertheless, in its underlying unheated state, rosin flux is normally in the non-corrosive and non-conductive thus does not affect circuitry. Moreover, fluxing action aids in removal of oxide, prevention of reformation of the new oxides thus allowing the solder to form the preferred intermetallic bond.

Work Cited

Jepson, Brian, Tyler Moskowite, & Gregory Hayes. Learn to Solder: Tools and Techniques for Assembling Electronics. Sebastopol, CA: OReilly & Associates, 2012. Print.

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